Thermal gap pad
Soft silicone pad filling gaps between electronics and heat sinks.
TIM
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Quantity
Typical specifications
- Thermal conductivity
- 1.5–8 W/m·K
- Thickness
- 0.5–5 mm
- Dielectric strength
- ≥ 6 kV/mm
Values are indicative ranges for this component type. Final specifications are confirmed in our quotation.
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